第四届中国国际半导体照明论坛暨展览会(2007上海)
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  Time:2008-4-13  15:53:59    Source:CSA    Author:CSA[Size:B M S ][Favorite][Close]

The 5th China International Forum on Solid State Lighting

July 24-26, 2008

Shenzhen Convention & Exhibition Center
, China

CONFERENCE GOAL

To accelerate international communication and cooperation in solid state lighting technologies, and advance development of its industry and market.
 
TOPICS

Areas of interests and topics as follows:
I. Technologies
- Novel materials & substrates for epitaxy
- Ultraviolet LEDs
- High power, high efficiency, long life white LEDs
- Efficiency at high current levels
- Application of photonic crystal materials & nanostructures in LEDs
- Color mixing & other novel methods to generate white LEDs
- LED chip fabrication improvements (light & heat extraction)
- Design & optimization for multi-chip packaging & modules
- Improvements of LED packaging materials
- Mass production techniques for LED packaging
- OLEDs lighting
 
II. Applications
- SSL market status & forecast
- Optical design of LED luminares
- Socket-compatible LED lighting systems
- Energy efficient LED lighting systems
- Integrated lighting system solutions for 2008 Beijing Olympics etc
- High efficiency LED road lighting
- Automotive LED lighting
- LED backlight for large LCD displays
- LED interior lighting
- Solar LED applications
- LEDs for projection applications
- LEDs for cell phone flash
- Applied technology of LED display
- High efficient drivers
- Lighting design software
- Requirements of SSL for green lighting applications in 2008 Beijing Olympic and 2010 Shanghai Expo
 
III. Standards & Equipment
- Color rendering measurements
- New standards for LED measurements
- LED measurement equipment
- Quantifying LED & LED system performance
- Methods & standards for reliability & lifetime test of LED devices
- Production MOCVD & other related LED fabrication equipment
- Management of process & cost
 
IV. Industrial Development
- Highlights overview & policies analysis
- Investment opportunities & risks
- Regional cooperation & development
- Patents
 
CONFERENCE COMMUNICATIONS

Three types available for communications:
1.  Oral Presentation
2.  Poster Presentation
3.  Proceeding
 
PAPER REQUIREMENTS

-The papers should not have already been published in the technical literature or by other academic conferences.
-The format is PPT or PDF, full length paper is not required.
-No commercial promotions involved for specific company and products.
-The language should be English. 
 
IMPORTANT DATES

1.  Paper Info Form & Paper Submission Deadline: May 20, 2008
2.  Early Registration Rate Deadline: May 31, 2008
3.  Paper Acceptance Notification: Mid-June, 2008
 
SUBMISSION

E-mail your Paper (PPT/PDF) to: 2008CHINASSL@gmail.com or submit it online at http://www.sslchina.org.  
Notice: Maximum 20M attachment capacity for a single email. For larger size file, please send it in parts.
 
CONTACT

For the latest updates of the conference, please contact:
CHINASSL2008 Secretariat
Mr. Tie Lin
Add: Room 1002C, Cyber Tower B, No.2 Zhongguancun South Avenue, Haidian District, Beijing (100086), China
Tel: +86 10 8251 2307 ext.19
Fax: +86 10 5172 7120

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        Tie Lin
        Tel:
        +86-10-82512307
        51727119
        Fax:
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        lint@china-led.net